Tag: snapdragon 845 SoC

Possible Xiaomi Mi MIX 2s Spotted On Geekbench
Xiaomi confirmed that the Xiaomi Mi MIX 2s will be launched in China on March 27th. Subsequently, the company has also teased about some of its features and specifications in the past few days. The device will support wireless charging. Also, the device will have AI-powered dual camera setup. Similarly, a new batch of live images has been leaked, which tells a different tale from what we have heard until now.

As per the newly leaked images, the device has a display similar to the Mi MIX 2, with a front-facing camera located on the bottom left corner. However, this goes against most of the leaks, which predicted a completely bezel-less design. Interestingly, the dual-camera setup is similar to the one found on Redmi Note 5 Pro.

Similarly, an unknown Xiaomi smartphone was also listed on Geekbench with the code name Xiaomi Dipper. The Xiaomi Dipper has 6GB RAM and powered by the Snapdragon 845 chipset. The device scored 2449 points on single-core and 8309 on multi-core performance. Since Xiaomi has already confirmed the presence of the Snapdragon 845 chipset, chances are that this could be it.

Source: Geekbench

Specifications of Xiaomi Mi MIX 2s

The smartphone is expected to have a 6 inch 2160 x 1080p display with a notch at the top right corner. Under the hood, the smartphone will be powered by the Qualcomm Snapdragon 845 chipset with 8GB RAM and 256GB storage. However, the smartphone will not support memory expansion.

The device will have an AI-powered dual camera setup. However, the dual camera implementation is yet to be known.

The device is expected to have a 3400 mAH Li-ion battery with wireless and fast charging. The phone will run on Android 8 Oreo OS with custom MIUI 9 skin on the top. However, none of the Xiaomi devices, barring the Mi A1, run on Android 8 Oreo as of now.
- 6 inch 18:9 aspect ratio display
- Qualcomm Snapdragon 845 chipset
- 6/8GB RAM and 128/256GB Storage
- AI-powered primary camera setup
March 12, 2018
Xiaomi Mi Mix 2s Specifications Leaked

Xiaomi has officially confirmed that the Xiaomi Mi Mix 2s will be unveiled in China on the 27th of March. A new live image of the smartphone has surfaced online, which sheds some light on the specifications of the Xiaomi Mi Mix 2s. In fact, the leaked image doesn’t say anything new, but it re-assures the already available information.

The Xiaomi Mi Mix 2s might be the third smartphone after the Galaxy S9 and Xperia Xz2 to launch with the Qualcomm Snapdragon 845 chipset. The specifications of the device are in-line with the other flagship smartphones of 2018.

Specifications:

The Xiaomi Mi Mix 2s has a 6.01-inch 2160 x 1080px IPS LCD display with a corner notch. The main difference between the original Xiaomi Mi Mix 2 and the Xiaomi Mi Mix 2s is the placement of the front-facing camera. The Xiaomi Mi Mix 2 didn’t have a notch. However, the front-facing camera was placed on an unusual bottom right corner. Similarly, the Xiaomi Mi Mix 2s’s camera is on the top right corner, which is an ideal place.

Under the hood, the smartphone is powered by Qualcomm Snapdragon 845 processor with 8GB RAM and 256GB storage. Like the original version, we might not see a dedicated micro SD card slot or a 3.5 mm headphone jack. The device has a dual camera setup with a 16 MP primary sensor. However, there isn’t much information on the secondary sensor.

Can you guess what is coming? pic.twitter.com/Gd10g3OsFf

— Xiaomi (@Xiaomi) February 25, 2018

The smartphone will run on Android 8 Oreo OS with custom MIUI skin on the top. The Xiaomi Mi Mix 2s has a massive 4400 mAh battery with possible support for Quick charge 4.0.

Conclusion:

One thing remains unclear about the smartphone despite the leaked image. The live image misses out on the tiny notch, that we have seen on the previously leaked press renders. Considering the specifications, the Mi Mix 2s looks like a great prospect especially with Xiaomi’s pricing strategy in mind.

February 27, 2018
Mysterious Android Device Running Snapdragon 845 Shows Up On GeekBench

Qualcomm launched the Snapdragon 845 chipset in late-2017. It will be the next flagship chipset for all Android devices and is expected to power the likes of Galaxy S9, OnePlus 6, Galaxy Note8 and more. While it has been confirmed that the Galaxy S9 and S9+ will be launched on the 25th if February, there are a few question marks around the launch of other Snapdragon 845-powered devices.

A new smartphone has shown up on GeekBench 4 running on Snapdragon 845 chipset. Unfortunately, the model number and even maker have been scrubbed. This means that there is no way to tell if this is the Mi Mix 2S, Xperia XZ Pro, Galaxy S9 or a different device altogether. The leaked device is also running Android 8 Oreo which means that the smartphone will at least have the latest OS out of the box.

Many rumours have hinted that Xiaomi will launch the Mi Mix 2S before MWC 2018 and that it will be the first ever 845-powered device in the world. However, with MWC about two weeks away, Xiaomi has not yet confirmed a launch event. This means that the company is confident about the Mi Mix 2S not being overshadowed by the launch of the Galaxy S9.

Along with Xiaomi and Samsung, Sony is expected to launch a flagship device as well at MWC 2018. The Sony Xperia XZ Pro will also be powered by the Snapdragon 845 chipset and run Android 8 Oreo.

February 9, 2018
Kirin 970 Might Be Better Than Snapdragon 845

Upcoming smartphones of 2018 will mostly be powered by the new Qualcomm Snapdragon 845 chipset. Back in October, Huawei unveiled its new flagship chipset, the HiSilicon Kirin 970 chipset with an NPU. A new image has been doing the rounds on Weibo that reveals a few benchmark results wherein the Kirin 970 appears to outscore the Snapdragon 845 chipset.

The benchmarks are of the Huawei Mate 10 Pro which was launched in October and is powered by the HiSilicon Kirin 970 chipset. It scores impressively, achieving 213258 points. The difference between the two chipsets isn’t enormous and should definitely not sway a consumer to the other side. Also, synthetic benchmark scores barely indicate what the real-world performance of a chipset is like, especially when the difference between the two is so marginal.

A few weeks ago, Samsung confirmed that it would manufacture the Snapdragon 845chipset on its 10nm LPP process. And now, a new report by Nikkei claims that TSMC is set to take over Samsung’s role for manufacturing Qualcomm’s modem and core processor orders next year.

The report reads:

Qualcomm’s flagship Snapdragon 835 and Snapdragon 845 processors are made by Samsung using 10nm technology. Snapdragon 835 processors have been adopted by a wide range of smartphone makers including Samsung, Oppo, Sony and Xiaomi, while Xiaomi will be the first to use the Snapdragon 845 chip that was unveiled earlier this month

The report also claims that an industry executive believes that Samsung is losing Qualcomm orders to TSMC because the company will not be fabricating 7nm chips in 2018. The report went on to state that “Qualcomm is still likely to transfer orders back to Samsung in 2019 if its 7nm chip facility becomes ready.”

December 25, 2017

Snapdragon 845: Everything You Need To Know

A majority of Android phones are powered by the chipsets made by Qualcomm. From phones priced at Rs 6999 running Snapdragon 212 to the Galaxy Note8 priced at Rs 67900 powered by the Snapdragon 835, smartphones in all price range run on a Qualcomm chipset, with some exceptions running MediaTek chipsets.

For 2018, the flagship phones will be powered by the new chip from Qualcomm, the Snapdragon 845 which was announced two days ago during the Qualcomm Tech Summit.

The Snapdragon 845 has the new Kryo 385 CPU architecture and an upgraded Adreno 630 GPU. The chip is built on Samsung’s 10nm LPP FinFET, its second generation 10nm node that offers “10-percent higher performance or 15-percent lower power consumption compared to its first generation”. Similar to the previous generation, the Kryo 385 is built on Arm Cortex technology. Qualcomm claims that thanks to its customised off-the-shelf design from Arm, the chip promises up to a 25% performance upgrade compared with the last generation Snapdragon 835. The four performance cores clock up to 2.8 GHz and are paired with four energy efficient cores that can reach up to 1.7 GHz.

A lot of experts claim that what bezel-less design was to 2017 smartphones, AI and machine learning will be to 2018 smartphones. With Apple and Huawei already claiming a stake in the AI space with their new chipsets, a lot will be expected from the Snapdragon 845. In terms of performance, the Snapdragon 845 gets a 3X upgrade in AI tasks over the Snapdragon 835. This comes down to upgraded CPU and GPU performance but, the Snapdragon 845 also includes a third generation Vector DSP with HVX, called the Hexagon 685, which is optimised for AI and imaging workloads.

Specifications	Snapdragon 845	Snapdragon 835
CPU Core	Semi-custom ARM Cortex – Kryo 385	Semi-custom ARM Cortex – Kryo 280
CPU Configuration	4x 2.8GHz (Cortex-A75) 4x 1.7GHz (Cortex-A55)	4x 2.45GHz (Cortex-A73) 4x 1.9GHz (Cortex-A53)
GPU	Adreno 630	Adreno 540
Manufacturing Process	10nm LPP FinFET	10nm LPE FinFET
DSP	Hexagon 685 with HVX	Hexagon 682 with HVX

For multimedia, Qualcomm’s latest Spectra image signal processor has been rebuilt from scratch. The new Spectra 280 ISP introduces new video capture options, such as 720P at 480fps, 60 fps video recording at up to 16MP of resolution, and the ability to capture 64x more high-dynamic range colour information than before.

Qualcomm has also introduced a new security feature. It has added Security Processing Unit (SPU), a hardware isolated security subsystem inside the Snapdragon 845. This dedicated chip acts as a storage unit for any saved biometric information, such as fingerprint, face, or iris scans, and builds on Qualcomm’s existing security software.

The Samsung Galaxy S9 and S9+ are expected to be the first of the many phones which will be powered by the Qualcomm Snapdragon 845 chipset. Xiaomi also announced that its new flagship, presumably Xiaomi Mi 7 will have the Qualcomm Snapdragon 845 chipset as well.

December 7, 2017

Qualcomm Announces Snapdragon 845 Chipset

Qualcomm has announced the new flagship chipset, the Snapdragon 845 at it Qualcomm Tech Summit.

The Snapdragon 845 will be the successor to the popular Snapdragon 835 chipset which powered the majority of 2017 flagship phones, barring the likes from Huawei and some Samsung phones (that ship outside the US and South Korea). The Snapdragon 845 will likely be found in many high-end Android phones in 2018, though it is also expected to make its way to Windows 10 laptops as well.

Just like the Snapdragon 835, the Snapdragon 845 is also based on a 10nm manufacturing process albeit upgrades to performance and power efficiency. Qualcomm will pair the 845 with its latest X20 LTE modem, which provides gigabit connectivity on supported networks.

The Snapdragon 845 will definitely aim to compete with Apple’s A11 Bionic chipset since the Snapdragon 835 fell short against it in benchmark scores.

Similar to the partnership that led to Samsung having early access to Snapdragon 835 chipsets, the Snapdragon 845 chipset might be found in the Galaxy S9 and S9+ before any other phone. Even though, the LG G7 is expected to be launched at a similar time. Also, Xiaomi has announced its plan to use the Snapdragon 845 chipset in its next flagship, which could be the Mi 7.

The American chipmaker is hosting its tech summit right now where we will get to know more about the Snapdragon 845 chipset.

December 6, 2017
Qualcomm Snapdragon 845 Could Be Announced In December

2018 will see most of the flagship smartphones being powered by the Snapdragon 845 SoC, which will succeed the Snapdragon 835 from 2017. Qualcomm is likely to announce the new flagship chipset, the Snapdragon 845 in December at the Snapdragon Technology Summit that will be held in Maui, Hawaii between 4th of December and the 8th of December.

The Snapdragon 835 was announced during CES 2017 in January of 2017 so, Qualcomm’s announcement might come a month prior to what is the norm. The Snapdragon 845 could be manufactured through 10nm Low Power Early (LPE) FinFET process. It is expected to have four ARM Cortex-A75 cores and four ARM Cortex-A53 cores. It is also reported that the new SoC will be paired with the Adreno 630 GPU, which is expected to deliver a significant graphical performance bump over the Adreno 540 that comes with the Snapdragon 835. The upcoming chipset will also be optimised for augmented reality (AR) and virtual reality (VR). Updated Kyro cores and X20 connectivity modem means upgraded downlink speeds of 1.2Gbps.

iGyaan reported that the Samsung Galaxy S9 could be the first device to feature the Qualcomm Snapdragon 845 chipset as per an agreement between Qualcomm and Snapdragon. In 2017, Samsung manufactured Qualcomm’s Snapdragon 835 chipset and got to keep the initial batch for itself. That’s why early in 2017 there was no other Snapdragon 835-powered handset on the market other than the Galaxy S8. This could be the case in 2018 as well.

October 30, 2017
Samsung May Have Early Access To Snapdragon 845

It looks like the Samsung Galaxy S9 and Galaxy S9+ will have an early access pass to Qualcomm’s next flagship chipset, Snapdragon 845. If Qualcomm decides to go for a similar deal with Samsung like last year’s Snapdragon 835, then Galaxy S9 could b the first device to have the next flagship processor. Samsung manufactured Qualcomm’s Snapdragon 835 chipset and got to keep the initial batch for itself. That’s why early in 2017 there was no other Snapdragon 835-powered handset on the market other than the Galaxy S8.

There isn’t a lot known about the Snapdragon 845 but, as the launch of the chipset comes near, there will be a lot more known about it. It is however, rumoured that it is expected to get manufactured through 10nm Low Power Early (LPE) FinFET process. The processor is also said to incorporate a combination of Cortex A75 cores, Adreno 630 graphics and X20 LTE modem. A report suggested that Qualcomm Snapdragon 845 SoC will be clocked at 2.5GHz, suggesting that the upcoming chip may not offer a significant improvement over the Snapdragon 835 as it clocks at 2.45GHz. A recent GeekBench listing of the Snapdragon 845 revealed a single core score of 2600+. In comparison, the Apple A9 scored around 2500 while the new A11 Bionic chipset on iPhone 8+ scored 4200+.

As far as availability is concerned, the Samsung Galaxy S9 and Galaxy S9+ will likely be the first smartphones to have the Qualcomm’s latest chip. This means that rivals like LG would have to go through yet another flagship cycle without access to Qualcomm’s latest chip, just like last year. There were rumours that Xiaomi’s Mi7 will also have the Snapdragon 845 chipset and that the smartphone and chipset manufactures were working together to optimise the chipset for the Mi7 called ‘Snapdragon 845 V2’.

October 10, 2017

Tag: snapdragon 845 SoC

Specifications of Xiaomi Mi MIX 2s

Specifications:

Conclusion: