Snapdragon 865 Details Leaked, To Arrive In Two Variants
American technology giant Qualcomm is best known for making mobile processors. Its latest flagship smartphone System on Chip (SoC) was the Snapdragon 855 which was launched last year. It was also the first chipset from the company to be manufactured on the 7nm fabrication process. Now, details about its successor, purportedly called the Snapdragon 865 have started to surface. According to a noted gadget tipster on microblogging website Twitter, the upcoming processor from Qualcomm for top tier devices will arrive in two variants.
According to the tipster, the Qualcomm employees refer the company’s next-generation flagship chipset by the name Snapdragon 865. It carries a model number SM8250, which falls in line with the lineup as the Snapdragon 855 was codenamed SM8150. The chipset is likely to be manufactured on the 7nm fabrication process like its predecessor. As mentioned above, the Snapdragon 865 will arrive in two variants, with one supporting 5G; the next generation of mobile connectivity, with the help of an integrated modem. The other variant will not have an integrated modem and should natively support 4G LTE networks and not 5G. The different variants are code-named Kona and Huracan, but it is not known which one carries the 5G modem.
The 5G modem inside the Snapdragon 865 will be the Qualcomm Snapdragon X55; which will be an upgrade over the existing Snapdragon X50 modem which is in use today. The tipster claims that the upcoming mobile SoC will also support LPDDR5X RAM and UFS 3.0 storage similar to the Snapdragon 855. Like the previous generations, it is expected that Qualcomm may announce the Snapdragon 865 in the month of December. The first smartphone to sport the latest flagship chipset from the company has been a Samsung smartphone since the last two years; so the upcoming processor may debut with the Galaxy S11 due next year.