Tag: Snapdragon 670

Qualcomm Snapdragon 670 Specifications Leaked

Qualcomm announced the Snapdragon 845 chipset in late-2017. The flagship chipset will power most of the flagship devices in 2018 but, the smartphone industry comprises a lot of budget smartphones. Hence, the onus is on Qualcomm to consistently produce great budget chipsets like the Snapdragon 625.

A couple of months ago, there were leaks surrounding the existence of Snapdragon 670 chipset. Now, a new leak has revealed all the specifications of the chipset. It is also expected to be announced at MWC 2018. The Snapdragon 670 will be a 10nm chipset that will not be based on the classic big.LITTLE architecture. Also, the chipset will comprise six low-end cores and two high-end cores. This is different from the usual four low-end and four high-end CPU cores.

Mi 6X Could Be Powered By The Snapdragon 670

The low-end cores, dubbed as Kryo 300 Silver will have a maximum clock speed of 2.6GHz. In a nutshell, the Kryo 300 Silver is just an adapted version of ARM Cortex A55. The high-end cores, called Kryo 300 Gold, is a custom version of ARM Cortex A75. The Kryo Gold will have a maximum processing speed of 1.7GHz.

Supporting the graphics will the Adreno 615 that works at 430MHz or 650MHz however, it can also reach 700MHz dynamically. The smartphones running on the Snapdragon 670 chipset will be expected to have top-notch performance. The Snapdragon 670 will support maximum download speeds of 1Gbps, thanks to the Snapdragon X2X modem. The chipset will offer support for UFS 2.1 and eMMC 5.1.

If the chipset is announced at MWC 2018, there are chances of OEMs adopting the chipset for their smartphones that are scheduled to launch in mid-2018 or later, like the Mi 6X.

February 9, 2018
Specifications Of Qualcomm Snapdragon 670, 640 And 460 Leaked

2018 will be a huge year for smartphones, irrespective of the price category they’ll be in. This year saw a lot of mid-range smartphones having flagship features like bezel-less designs and dual-camera setups. While we already know all about the flagship chipset from Qualcomm, the Snapdragon 845, there isn’t clarity as to what the mid-range smartphones will be powered by.

A new, however, has revealed the possible specifications of three new upcoming chipsets from Qualcomm, the Snapdragon 670, 640 and 460. Three chipsets which possibly power a lot of mid-range phones in 2018.

The Qualcomm Snapdragon 670 will succeed the Snapdragon 660 as the most powerful mid-tier chipset that Snapdragon will have to offer. While the Snapdragon 660 was built on a 14nm process, the Snapdragon 670 will move to a 10nm process similar to the Snapdragon 845. The chipset will have an octa-core processor with four Kryo 360 cores clocked at 2 GHz and four Kryo 385 cores clocked at 1.6 GHz. It’ll also feature an Adreno 620 GPU.

The Qualcomm Snapdragon 640 will offer something different than every other chipset, a 6+2 core combination CPU. It will have two Kryo 360 cores clocked at 2.15 GHz and six Kryo 360 cores clocked at 1.55 GHz. This is possible thanks to ARM’s DynamIQ, which allows for mixing and matching for Cortex-A75 and A55 CPU cores. With DynamIQ, there can be a total of eight cores in a cluster which is exactly what we’re seeing in the Snapdragon 640. Similar to the Snapdragon 670, the 640 will also be made on the 10nm process.

The Snapdragon 460 will likely power smartphones under the Rs. 15000 price bracket. According to the leak, it will have four Kryo 360 cores clocked at 1.8 GHz and four Kryo 360 cores clocked at 1.4 GHz. It will be built on the 14nm process, unlike the other two chipsets.

Whether early-2018 entrants adopt any of the chipsets is yet to be seen as not a lot of mid-tier smartphones of 2017 even used the Snapdragon 660 chipset.

December 29, 2017
Qualcomm To Launch Snapdragon 670 Chipset In Q1 Of 2018

Every year, it is not just the flagship lineup of chipsets from Qualcomm gets a refresh. The mid-range segment of smartphones has even tougher competition between Qualcomm and MediaTek, and Qualcomm will soon launch the Snapdragon 670 chipset in 2018.

The Snapdragon 670 chipset will be based on Samsung’s 10-nanometer (nm) LPP process technology which was also used in Qualcomm’s 2017 flagship chip, the Snapdragon 835. Samsung used the same process for its 2017 flagship chipset, the Exynos 8895.

A famous leakster tweeted a few details about the upcoming Snapdragon 670 chipset:

Qualcomm testing new Snapdragon 670 (SDM670) – their test platform has
4/6 GB LPDDR4X RAM
64 GB eMMC 5.1 flash storage
WQHD screen
22,6 + 13 MP camera.

— Roland Quandt (@rquandt) December 20, 2017

According to the report, the Snapdragon 670 will go into mass production in early-2018 and will be subsequently available for OEMs.

Qualcomm recently unveiled its 2018 flagship chipset, the Snapdragon 845 which was also manufactured by Samsung. Recent reports have claimed that the South Korean tech giant will lose its business from Qualcomm as the Snapdragon 855 is expected to be manufactured by TSMC.

The report also claims that an industry executive believes that Samsung is losing Qualcomm orders to TSMC because the company will not be fabricating 7nm chips in 2018. The report went on to state that “Qualcomm is still likely to transfer orders back to Samsung in 2019 if its 7nm chip facility becomes ready.”

As much as the Snapdragon 845 is important, markets like India sell mid-range smartphones much more than their flagship counterparts, hence the Snapdragon 670 and its adequacy will be important for upcoming mid-range smartphones in 2018.

December 28, 2017