Specifications Of Qualcomm Snapdragon 670, 640 And 460 Leaked
2018 will be a huge year for smartphones, irrespective of the price category they’ll be in. This year saw a lot of mid-range smartphones having flagship features like bezel-less designs and dual-camera setups. While we already know all about the flagship chipset from Qualcomm, the Snapdragon 845, there isn’t clarity as to what the mid-range smartphones will be powered by.
A new, however, has revealed the possible specifications of three new upcoming chipsets from Qualcomm, the Snapdragon 670, 640 and 460. Three chipsets which possibly power a lot of mid-range phones in 2018.
The Qualcomm Snapdragon 670 will succeed the Snapdragon 660 as the most powerful mid-tier chipset that Snapdragon will have to offer. While the Snapdragon 660 was built on a 14nm process, the Snapdragon 670 will move to a 10nm process similar to the Snapdragon 845. The chipset will have an octa-core processor with four Kryo 360 cores clocked at 2 GHz and four Kryo 385 cores clocked at 1.6 GHz. It’ll also feature an Adreno 620 GPU.
The Qualcomm Snapdragon 640 will offer something different than every other chipset, a 6+2 core combination CPU. It will have two Kryo 360 cores clocked at 2.15 GHz and six Kryo 360 cores clocked at 1.55 GHz. This is possible thanks to ARM’s DynamIQ, which allows for mixing and matching for Cortex-A75 and A55 CPU cores. With DynamIQ, there can be a total of eight cores in a cluster which is exactly what we’re seeing in the Snapdragon 640. Similar to the Snapdragon 670, the 640 will also be made on the 10nm process.
The Snapdragon 460 will likely power smartphones under the Rs. 15000 price bracket. According to the leak, it will have four Kryo 360 cores clocked at 1.8 GHz and four Kryo 360 cores clocked at 1.4 GHz. It will be built on the 14nm process, unlike the other two chipsets.
Whether early-2018 entrants adopt any of the chipsets is yet to be seen as not a lot of mid-tier smartphones of 2017 even used the Snapdragon 660 chipset.