Apple iPhone XI 7 nm+ SOC Risk Production Started By TSMC
TSMC, a Taiwanese OEM that produces semiconductors and chipsets. Founded in the year 1987 the company currently holds the title for world’s largest dedicated independent semiconductor foundry. Corporations including Apple, Qualcomm and AMD are one of the few customers of TSMC.
The company has qualified a significant achievement in the field of chipset technology which is starting risk production of 5 nm chips. This step would allow the company to reduce the size of a given chipset by up to 45% in comparison to the current technology which is 7 nm. Furthermore, it will provide a performance boost of up to 15% in devices that incorporate the chipset. Even though the size of the foundation die has changed, the architecture of a particular chipset remains the same (eg: A73, Kryo 460). Accrediting to the size reduction, devices using the chipset manufactured using 5 nm process will be more power efficient. Therefore, proving for a longer battery backup on portable devices.
Except for the 5 nm process node, TSMC is also working on the 5 nm+ technology which will push a chipsets performance even further. However, the risk production of chipsets with this fabrication process will reportedly begin next year and they will be production ready by Q1 of 2021. For chipsets originating later this year, the company has 7 nm+ process ready. It should offer 20 % higher transistor density and 6-12% reduction in power consumption.
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Notable companies that are lined up for the 7 nm+ based chipsets manufactured by TSMC include Qualcomm and Apple. TSMC being the sole chip supplier for Apple, at least until now, will manufacture SoCs for 2019 iPhones. Consequently, the upcoming smartphones from Apple will be kitted with 7 nm+ based chipsets which is assumed to carry the A13 Bionic moniker.