Qualcomm Snapdragon 670 Specifications Leaked
Qualcomm announced the Snapdragon 845 chipset in late-2017. The flagship chipset will power most of the flagship devices in 2018 but, the smartphone industry comprises a lot of budget smartphones. Hence, the onus is on Qualcomm to consistently produce great budget chipsets like the Snapdragon 625.
A couple of months ago, there were leaks surrounding the existence of Snapdragon 670 chipset. Now, a new leak has revealed all the specifications of the chipset. It is also expected to be announced at MWC 2018. The Snapdragon 670 will be a 10nm chipset that will not be based on the classic big.LITTLE architecture. Also, the chipset will comprise six low-end cores and two high-end cores. This is different from the usual four low-end and four high-end CPU cores.
The low-end cores, dubbed as Kryo 300 Silver will have a maximum clock speed of 2.6GHz. In a nutshell, the Kryo 300 Silver is just an adapted version of ARM Cortex A55. The high-end cores, called Kryo 300 Gold, is a custom version of ARM Cortex A75. The Kryo Gold will have a maximum processing speed of 1.7GHz.
Supporting the graphics will the Adreno 615 that works at 430MHz or 650MHz however, it can also reach 700MHz dynamically. The smartphones running on the Snapdragon 670 chipset will be expected to have top-notch performance. The Snapdragon 670 will support maximum download speeds of 1Gbps, thanks to the Snapdragon X2X modem. The chipset will offer support for UFS 2.1 and eMMC 5.1.
If the chipset is announced at MWC 2018, there are chances of OEMs adopting the chipset for their smartphones that are scheduled to launch in mid-2018 or later, like the Mi 6X.