A New Hybrid Heatsink Makes Your Computer Run Faster
The traditional way with which most computers deal with heat is a heat-sink and a fan assembly over the processor. Of course you have custom solutions like liquid cooling, but they’re out of the budget for most people. Unfortunately, this idea is quite dated and hails from the heydays of computing. New technology requires new solutions and that’s exactly what Jeff Koplow, a researcher at Sandia National Laboratories has developed.
The problem with traditional heat-sinks is that, while the fins provide adequate surface area to cool the processor, a layer of air clings to the fins, which reduces efficiency, acting as an insulator. To compensate, the CPU fan can be cranked up to move more air, but that becomes noisy and uses more energy. As the heat-sink itself doesn’t move, it becomes a great place for dust to settle.
Jeff has come up with an ‘air bearing heat exchanger’, which is just a fancy way of saying that he’s combined the heat-sink and fan into a spinning heat-sink. The heat exchanger is separated from the processor by just 1/1000th of an inch, and as it spins, it forces air out from the center of the exchanger, cooling the fins and eliminating the insulating layer of air. This turns out to be so efficient, that it can be run at much lower and quieter speeds. You can even overclock your CPU a few notches without it being any worse for the wear. As the heat-sink is spinning, it also becomes immune to dust.
A prototype has been developed which doesn’t require any fancy metals or electronics, just good design. This hopefully means that the technology will be easily mass producible and will be available to the market soon.
