Next Sony Flagship Will Have The Snapdragon 845 Chipset
Sony and its upcoming flagship phones have been in the news for the past few days. Various image leaks are pointing towards a design overhaul for the Sony flagship lineup and it appears that the company will take it up a notch.
A new Geekbench listing reveals the Sony H8266 device being powered by the Qualcomm Snapdragon 845 chipset. Apart from the chipset, the listing reveals that it will have 4GB of RAM which has become standard for all flagships nowadays.
The news about it sporting the Snapdragon 845 chipset is a welcome surprise as it was widely speculated that Samsung will have exclusive early access to the new flagship chipset.
The image reveals a design similar to the Xiaomi Mi Mix 2 with three sides of the device having minimal bezels and the top housing all the sensors and the secondary camera. Although the Xiaomi Mi Mix 2 has a thicker chin, the Xperia phone has a thicker forehead. The phone appears to have the power button on the side, most likely with a fingerprint scanner embedded. There is also a volume rocker and dedicated camera button on the right side.
Just like any other leaked image, it is fair to assume that this could easily be a doctored image and the real device could have a completely different design. But, until the time Sony announces the device itself, it is a good design cue for the company. Recently, images of two Sony Xperia phones were leaked along with a few specifications. Just like the image, these images also reveal the design shift that Sony will make in 2018 for all its flagship phones in 2018.
The next Xperia device could be unveiled at the upcoming CES or MWC event where a lot of other smartphones are also expected to be announced, most notably the Samsung Galaxy S9 and S9+.