Realme Flagship Smartphone With Snapdragon 855 SoC Leaked, Launch Imminent
Realme launched its latest device, the Realme 3 Pro at an event on the 22nd of April. The smartphone boasts of competitive specifications at a lucrative price tag. While it was long believed the aforementioned handset is the company’s flagship offering, a recent leak reveals Realme has other plans. An unknown smartphone with the model number RMX1901 has surfaced on Chinese certification website TENNA. The device is reported to feature top tier specifications and a significantly affordable price than the competition.
Realme’s Flagship Smartphone
The upcoming smartphone from Realme will be the company’s first flagship offering. Leaked details reveal it will measure 161.2 × 76 × 9.4 mm and will sport a polycarbonate body like the Realme 3 Pro. The back of the handset has been shown to have a gradient colour scheme. It will have a 6.5-inch display OLED display with an FHD+ resolution. Images of the device insinuate it will use a pop-up mechanism to house the front camera. Since a physical fingerprint scanner is not visible anywhere around the smartphone, an in display sensor is expected to make its debut on the device.
Reports claim the upcoming flagship smartphone from Realme will run on the 7nm Snapdragon 855 SoC. The chipset is comprised of an Octa-core CPU and uses the Adreno 640 GPU for graphics. The images reveal the device will have a vertically stacked dual rear camera setup, details of which are unknown at the moment. For selfies, a single front-facing camera is expected to be housed in the pop-up mechanism on top of the display. More details about the memory and storage remain shrouded in mystery as of yet.
The listing further reveals the Realme flagship smartphone will be powered by a 3680 mAh battery with support for VOOC fast charging. The handset is likely to run on the company’s latest ColorOS 6 on top of current Android 9 Pie. While the company hasn’t made any announcement regarding the device, the listing suggests it may launch soon.